Integrated Packaging Assembly Corporation
Ticker: IPAC 2221 Oakland Road
Exchange: NASDAQ-National Market San Jose, California 95131
Industry: Manufacturing (408) 321-3600

Type of Shares:Common Shares Filing Date:1/24/96
U.S. Shares:3,000,000 Offer Date:2/28/96
Non-U.S. Shares:0 Filing Range:$7.00 - $9.00
Primary Shares:3,000,000 Offer Price:$7.50
Secondary Shares:0 Gross Spread:$0.53
Offering Amount: $24,000,000 Selling:$0.32
Expenses:$800,000 Reallowance:$0.10
Shares Out After:13,392,904

ManagerTierPhone
Donaldson, Lufkin & Jenrette Securities Corp.Lead Manager (212) 504-4525
Robertson, Stephens & CompanyCo-manager (415) 989-8500

Auditor: Price Waterhouse
Audited
Income
Latest
Unaudited
Income
Prior
Unaudited
Income
Balance
Sheet
12/31/95 12/31/95
Revenue:$20.76Assets:$28.26
Net Income:$1.55Liabilities:$29.18
EPS:$0.14Equity:-$0.92

Note: Dollar amounts are in U.S. millions; Audited figures expressed as full year,
unaudited figures are partial year

Business Description
The company is a leading independent North American semiconductor packaging foundry. The company receives wafers from its customers and assembles each integrated circuit in a protective plastic package. The company's close proximity to its customers and the end-users of its customer's products allows it to provide quick turnaround design and prototype production and timely delivery of products in high volume. The company has been engaged in a continual program to expand its production capacity since the company commenced commercial production in January 1994. To meet their packaging requirements, semiconductor companies have relied on captive or independent packaging foundries, principally located in Asia. These packaging foundries were initially located in Asia in the 1970's to take advantage of low labor costs. During the 1980's semiconductor packaging commenced a transition from a labor intensive operation to a capital intensive, technologically advanced operation as packaging facilities were forced to automate significantly more complex devices while achieving consistency, quality and reliability.

Use of Proceeds
The proceeds from the proposed offering will be used for capital equipment purchases and other general corporate purposes including working capital.

Last updated: 10/28/96

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