| Ticker: SLIC | 148 Vestal Parkway East | |
| Exchange: NASDAQ-Small Cap Market | Vestal, New York 13850 | |
| Industry: Manufacturing | (607) 754-0112 |
| Type of Shares: | Common Shares | Filing Date: | 1/30/96 | |
| U.S. Shares: | 1,700,000 | Offer Date: | 3/19/96 | |
| Non-U.S. Shares: | 0 | Filing Price: | $5.00 | |
| Primary Shares: | 1,700,000 | Offer Price: | $5.00 | |
| Secondary Shares: | 0 | Gross Spread: | $0.50 | |
| Offering Amount: | $8,500,000 | Selling: | $0.20 | |
| Expenses: | $755,100 | Reallowance: | $0.10 | |
| Shares Out After: | 3,243,653 |
| Manager | Tier | Phone |
| Whale Securities Company | Lead Manager | (212) 484-2057 |
| Auditor: Price Waterhouse | |||||
| Audited Income | Latest Unaudited Income | Prior Unaudited Income | Balance Sheet | ||
| 12/31/95 | 12/31/95 | ||||
| Revenue: | $0.00 | Assets: | $0.84 | ||
| Net Income: | $1.15 | Liabilities: | $0.54 | ||
| EPS: | -$0.92 | Equity: | $0.30 | ||
Note: Dollar amounts are in U.S. millions; Audited figures expressed as full year, unaudited figures are partial year | |||||
| Business Description |
| The company is a developmental stage company focused on commercial manufacturing facilities for production of high power semiconductor diode lasers ("HPDL's"). The company has been engaged primarily in developing and improving upon the use of patent-pending technology (known as Desorption Mass Spectrometric Control ("DMS")) to control and increase the reliability of a commonly known laser manufacturing process referred to as Molecular Beam Epitaxy ("MBE"). The use of the DMS technology to control the MBE production of HPDLs will, the company believes, not only offer significant cost advantages over the MBE production of HPDLs without DMS but, more importantly, will also offer significant cost advantages over the currently prevailing manufacturing process for HPDLs known as Metal Organic Chemical Vapor Deposition ("MOCVD"). The company intends to capitalize upon such advantages to produce HPDLs which meet or exceed the quality standards of existing HPDLs, at lower cost, thereby permitting the company to reduce the prices charged for HPDLs and facilitate new market applications for HPDL products. |
| Use of Proceeds |
| Proceeds from the proposed offering will be used to establish the production facility capabilities, repayment of bridge notes, expansion of proposed manufacturing facilities and of a computerized process control system, for research and development and for working capital and for general corporate purposes. |
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