Semiconductor Laser International Corporation
Ticker: SLIC 148 Vestal Parkway East
Exchange: NASDAQ-Small Cap Market Vestal, New York 13850
Industry: Manufacturing (607) 754-0112

Type of Shares:Common Shares Filing Date:1/30/96
U.S. Shares:1,700,000 Offer Date:3/19/96
Non-U.S. Shares:0 Filing Price:$5.00
Primary Shares:1,700,000 Offer Price:$5.00
Secondary Shares:0 Gross Spread:$0.50
Offering Amount: $8,500,000 Selling:$0.20
Expenses:$755,100 Reallowance:$0.10
Shares Out After:3,243,653

ManagerTierPhone
Whale Securities CompanyLead Manager (212) 484-2057

Auditor: Price Waterhouse
Audited
Income
Latest
Unaudited
Income
Prior
Unaudited
Income
Balance
Sheet
12/31/95 12/31/95
Revenue:$0.00Assets:$0.84
Net Income:$1.15Liabilities:$0.54
EPS:-$0.92Equity:$0.30

Note: Dollar amounts are in U.S. millions; Audited figures expressed as full year,
unaudited figures are partial year

Business Description
The company is a developmental stage company focused on commercial manufacturing facilities for production of high power semiconductor diode lasers ("HPDL's"). The company has been engaged primarily in developing and improving upon the use of patent-pending technology (known as Desorption Mass Spectrometric Control ("DMS")) to control and increase the reliability of a commonly known laser manufacturing process referred to as Molecular Beam Epitaxy ("MBE"). The use of the DMS technology to control the MBE production of HPDLs will, the company believes, not only offer significant cost advantages over the MBE production of HPDLs without DMS but, more importantly, will also offer significant cost advantages over the currently prevailing manufacturing process for HPDLs known as Metal Organic Chemical Vapor Deposition ("MOCVD"). The company intends to capitalize upon such advantages to produce HPDLs which meet or exceed the quality standards of existing HPDLs, at lower cost, thereby permitting the company to reduce the prices charged for HPDLs and facilitate new market applications for HPDL products.

Use of Proceeds
Proceeds from the proposed offering will be used to establish the production facility capabilities, repayment of bridge notes, expansion of proposed manufacturing facilities and of a computerized process control system, for research and development and for working capital and for general corporate purposes.

Last updated: 10/28/96

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