Macronix International Company, Ltd.
Ticker: MXICY No 3 Creation Road III, Science-Based Industrial Park
Exchange: NASDAQ-National Market Hsinchu, Foreign
Industry: Manufacturing 8635788888

Type of Shares:American Depositary Receipts Filing Date:3/4/96
U.S. Shares:6,000,000 Offer Date:5/9/96
Non-U.S. Shares:4,000,000 Filing Price:$17.62
Primary Shares:10,000,000 Offer Price:$17.67
Secondary Shares:0 Gross Spread:$0.71
Offering Amount: $176,200,008 Selling:$0.41
Expenses:$1,909,567 Reallowance:$0.10
Shares Out After:60,000,000

ManagerTierPhone
CS First BostonLead Manager (212) 909-3312
Goldman, Sachs & Co.Co-manager (212) 902-1172
Hambrecht & Quist IncorporatedCo-manager (415) 576-3423

Auditor: Ernst & Young
Audited
Income
Latest
Unaudited
Income
Prior
Unaudited
Income
Balance
Sheet
12/31/95 12/31/95
Revenue:$324.90Assets:$647.34
Net Income:$68.10Liabilities:$259.04
EPS:$1.60Equity:$388.30

Note: Dollar amounts are in U.S. millions; Audited figures expressed as full year,
unaudited figures are partial year

Business Description
The company is Taiwan's largest read-only-memory (ROM) chip manufacturer and other semiconductor related products. The Company's products are used in a wide range of communications, computer and computer peripheral and consumer electronics applications. The Company distributes its products and conducts its sales through a dedicated sales force operating out of sales offices in Taiwan and the United States and a network of distributors and manufacturers' representatives in Japan, the United States and elsewhere. The company derives its revenue primarily from the manufacture and sale of four types of ICs mask ROM, EPROM, flash memory and logic. The company's core logic products, many of which comprise memory products embedded in logic devices in a single integrated circuit chip, are high value added products, affording the company the ability top provide a range of system related solutions to customers, such as module chip set or system on chip solutions.

Use of Proceeds
The proceeds from the offering will be used to fund the construction of a new semiconductor construction facility in Hsinchu, Taiwan.

Last updated: 10/28/96

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